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  • Etching holes in aluminum (Pablo Bianucci)
  • Spherical lumps of Au for E-beam evaporated film (Changsoon Kim)
  • Anodic bonding SOI wafer and glass (A.K.Ismail)
  • my Pyralin is breaking off (Yair)
  • Anodic bonding SOI wafer and glass (Kristian Pontoppidan Larsen)
  • Anodic bonding SOI wafer and glass (Blunier, Stefan)
  • Etching holes in aluminum (Bill Moffat) (4 parts)
  • LOR lift-off (Bill Moffat) (4 parts)
  • Piezoelectricity (vincent.mortet@luc.ac.be)
  • Moving samples in RIE (BobHendu@aol.com)
  • Looking for used Delvotec and Hesse+Knipps Bonder (Mighty Platypus)
  • Spherical lumps of Au for E-beam evaporated film (Mighty Platypus)
  • Glas seal for ceramic package (Torsten Kießling)
  • Moving samples in RIE (Henry Yang)
  • Anodic bonding SOI wafer and glass (Tony Rogers)
  • Spherical lumps of Au for E-beam evaporated film (Rick Williston)
  • probs removing S1813 from glass after E-beam evap (Timothy D. Meehan)
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