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  • the relationship between backing temperature and time and post treatments such as exposure or developing (Gunwoo Kim)
  • Passivation of GaAs (110) surface (Fabio Altomare)
  • MEMS for Shear Stress (BME 401 Group 5)
  • Ni etchant which dose not attack Cr (Devendra Kumar Maurya)
  • dry etch indium oxides and tin oxides (Andre Wong)
  • about pressure sensor (sreeram mahalingam)
  • Chromium Wet Etching (Wright, Jason)
  • Photopatterning (sandhya sandhya)
  • Wet etchant not attack Al and SiO2 (HE,Han+AFw-(Johnny+AFw-))
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