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  • sputtering of TiO2 (Swaroop Kaza)
  • What is the etch rate of SU-8 in O2 plasma? (S.O. Ryu)
  • Is the interface of polysilicon and Cr Ohmic contact ? ([email protected])
  • How to minimize the inner stress of adhesive? (高 晓童)
  • Etch through Si wafer with TMAH (Andreas Jahn)
  • How to minimize the inner stress of adhesive? (Toan Ly)
  • What is the etch rate of SU-8 in O2 plasma? ([email protected])
  • seeking services: dep of thick insulators (John Chiaverini)
  • seeking services: DRIE of glass, quartz, etc. (John Chiaverini)
  • What is the best first layer for the multi-layer process? (Park, Sang Won (Daniel))
  • anodic glass-glass (Zigurts Majumdar)
  • Piranha cleaning on the GaAs wafer (Kim, GunWoo)
  • Etch through Si wafer with TMAH (il-seok Son)
  • polymer resistant to KOH etch (Mac Daily) (2 parts)
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