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  • Selectivity between pylex glass and silicon nitride in dry etching(release) (심유석)
  • PDMS irreversialbe bonding (Mark Fuller)
  • Measure polysilicon grain size (CHEW SOON AIK)
  • Wafer mounting (David Nemeth)
  • discussion of MEMS CAD tools (Robert Dean)
  • Glass machining (Sang Hwui Lee)
  • two photoresist layers (Yilei Zhang)
  • Polyimide layer as substrate layer (Abhinav Bhushan)
  • Looking for Silica-on-Silicon Wafers (Bing Yu)
  • Anodic bonding glass+aluminum+glass ([email protected])
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Process Variations in Microsystems Manufacturing
The Branford Group