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Photosensitive SAM (Yi-Ping Ho)
CMOS silicon conductivity (Mina Raieszadeh)
Micro flow meter (Ko Ihara)
low temperature anodic bonding (taya sunil)
On diffusion bonding of two stainless steel pieces (:(): oxxxxxx|)
shape testing error in ansys (Sharmita Das)
Non-oxidizing Adhesion Layer (Louis Chomas)
Low Stress Nitride Residual Stress Measurment KLA P10 (Ahmed Shuja)
MEMS Service (madhulika sathe)
PMMA as microcantilever material (Samir Kagadkar)
Looking for stress-fatigue life data of Silicon MEMS components (
[email protected]
)
what about platinum over silicon dioxide? (Sebastian Sosin)
On diffusion bonding of two stainless steel pieces (RobDavis)
Solgel process / low temperature bonding (Robert Smith)
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