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  • Adhesion problem Between Aluminium and Photoresist (Charles Ellis)
  • Very thick silicon wafers (Thomas Grebinski MIND) (2 parts)
  • Frequently used materials in MEMS (mahdi bagheri)
  • Thermal coefficient of expansion on SI vs orientation (D H Grantham)
  • Electrodeposition of Photoresist (mems work) (Matthieu Gaudet)
  • ANSYS OPTIMIZATION (Jayaram)
  • Thin SU-8, SU-8 2002 (Werner Karl)
  • Adhesion problem Between Aluminium and Photoresist (Bill Moffat)
  • Thin SU-8, SU-8 2002 (Brubaker Chad)
  • ANSYS OPTIMIZATION (Dnyanesh Pawaskar)
  • 3" sapphire wafer (Honggang Jiang)
  • how to etch glass 7740? (Kirt & Erika Zipf-Williams)
  • Protecting Aluminium Bond Pads from Corrosion (Kirt & Erika Zipf-Williams)
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