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  • Bonding a plastic cover on a quartz chip with platinumheaters (Cheng Ming Lin)
  • Diches in diaphragm in KOH bulk micromachining (mahdi bagheri)
  • Re: Plasma activation for Wafer Bonding (BRIAN DOUGLAS)
  • Plasma activation for Wafer Bonding (Felix Lu)
  • etch silicon selectively over pmma/Ni (Abhinav Bhushan)
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