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  • Ti and Cr resistivity (Damiano Galvan)
  • pdms (Michael Cooke)
  • removing metal films from (100) silicon (Wilson, Thomas)
  • Ti and Cr resistivity (MT Klaus Beschorner)
  • pdms (Adrian Brozell)
  • Au Thermocompression Wafer Bonding Services (Jared Mehl)
  • wire bonding info (Ananth Krishnan)
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Harrick Plasma
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Tanner EDA by Mentor Graphics
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Process Variations in Microsystems Manufacturing