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  • SU-8 2050 Cladding Material (Nan Xie)
  • Recrystallization Temperature of Pt and Ti (Kamal Kishore)
  • DRIE etching on Silicon bonded to PYREX wafer (Badin Damrongsak)
  • Removing epoxy from silicon carbide (Chris Bower)
  • Removing epoxy from silicon carbide (shay kaplan)
  • Electrostatic actuation in ANSYS 8.1 (Mems II)
  • DRIE etching on Silicon bonded to PYREX wafer (Marc Straub)
  • Thin films (Sarfaraz Moh)
  • Removing epoxy from silicon carbide (Mark Fuller)
  • Etchant for SiO2 without etching Aluminum (Ramesh Narayanan)
  • selective wet etching of Si with ZnO (Christiane Rieger)
  • Re: DRIE etching on Silicon bonded to PYREX wafer (Marco Doms)
  • PDMS-glass bonding (Shramik Sengupta)
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