MEMS-talk

A MEMS Clearinghouse^® and information portal
for the MEMS and Nanotechnology community

News	MEMSnet Home: MEMS-Talk .. Adhesion problem (Shile) Su-8 bonding clogging problem (Brubaker Chad) Tantullum Nitride Diffusion Barrier Testing (Richard Toftness) SU8 and PDMS question (Silvan Schmid) omnicoat stripper and SU-8 ([email protected]) is there anything else replacing SiO2 or Si3N4 for Si etch mask (KOH)? (Liu X.F.) thermal oxide quality on heavily doped Si? (Krogmann, Florian) SU8 shrinkage (Michael L) Adhesion for Al (Andrew Xiang) Cured polyurethane glass-bonding (Bill Moffat) Adhesion for Al (Paolo Tassini) macroporous Si template need (XIN LI) is there anything else replacing SiO2 or Si3N4 for Sietch mask (KOH)? (Joe Lonjin) Boron removal (Michael Cooke) Tantullum Nitride Diffusion Barrier Testing (PATEL JITENDRA) Adhesion for Al (Joe Lonjin) Cured polyurethane glass-bonding (Sujatha Ramachandran) How to include damping effect in ANSYS? (ning) FW: [mems-talk] Cured polyurethane glass-bonding (Shile) anodic bonding in a near vaccum (Robert Dean) Boron removal (Pierre Huet)
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