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  • Through Hole etching of evry deep holes - Aspect ratio - 25-30 (Pradeep Dixit)
  • details on microfluidics (vishwanath sai)
  • help on tungsten / tungsten silicide selective etch (Jialin Zhao)
  • Problem with airbubbles on PDMS-surface in water ([email protected])
  • details on microfluidics (FRANK BOEHM)
  • details on microfluidics (wahid YEMI.)
  • Problem with airbubbles on PDMS-surface in water ([email protected])
  • literature to on newtonian fluids near surfaces (Marc Hennemeyer)
  • Through Hole etching of evry deep holes - Aspect ratio - 25-30 (Shane Arthur McColman)
  • Through Hole etching of evry deep holes - Aspect ratio- 25-30 ([email protected])
  • About the RIE etch of SiO2 (Joe Lonjin)
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