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  • Cracks on SU-8 during the development (Schoembs, Ulrike)
  • copper beam etching (Ramesh Narayanan)
  • Adhesion problem of SU-8 on metal surface (Michael L)
  • TaN thin film as Barrier for Copper diffusion (PATEL JITENDRA)
  • TaN thin film as Barrier for Copper diffusion (Kirt Williams)
  • TaN thin film as Barrier for Copper diffusion (vishwanath sai)
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