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  • TaN thin film as Barrier for Copper diffusion (Niv)
  • Adhesion problem of SU-8 on metal surface (Maria Nordstrom)
  • Cracks on SU-8 during the development (Schoembs, Ulrike)
  • Plasma etching MWCNTs (Patrick Roman)
  • Q: PDMS mechanical property (CY Park)
  • Q: PDMS mechanical property (Patrick Roman)
  • photoresist or polyimide sacrificial layer (Rihui He)
  • su-8 air bubble problem (Brubaker Chad)
  • Adhesion problem of SU-8 on metal surface (Brubaker Chad)
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