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  • E-beam Platimun lift-off from Polyimide (Nels P. Ostrom)
  • Reg: problems with SU-8 bonding to the silicon wafer (Brubaker Chad)
  • Sputtered ZnO (bruno)
  • Thin PDMS Films ([email protected])
  • Boron doping ([email protected])
  • contamination after KOH etching (Dan.W.Chilcott)
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Process Variations in Microsystems Manufacturing