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  • Masking Materials for Ni/Au Electroplating (PRAMOD GUPTA)
  • SU8 maximum aspect ratio (Ren Yang)
  • how to seprate electroplated copper from gold seed layer wafer (Pradeep Dixit)
  • roughing of photoresist in RIE (乔大勇)
  • roughing of photoresist in RIE (Brent Garber)
  • RE: Argon plasma for gold etching (Richard)
  • roughing of photoresist in RIE (Nicolas Duarte)
  • roughing of photoresist in RIE (乔大勇)
  • roughing of photoresist in RIE (Nicolas Duarte)
  • RE: Argon plasma for gold etching ([email protected])
  • Lift-off using SU-8 (Lung-hao Hu)
  • Deep Si etch 8" wafers (Mac McReynolds)
  • SU-8 Plasma removal ([email protected])
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