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  • Simulation software (Hari)
  • Re: SU8 fabrication on coverglass ([email protected])
  • Photoresist RIE (David Kallweit)
  • Wafer Planarization (ssood)
  • Polyimide (Ad Hall)
  • CMOS compatability of Polyimide (WILLIAMSON Fraser)
  • Making a Cr mask with rings (MAI, JUNYU)
  • Encapsulant for wire bonding (FrançoisTherriault Proulx)
  • CMOS compatability of Polyimide (shay kaplan)
  • Encapsulant for wire bonding (Sebastien Allard)
  • Copper etchant recommendation (Iskandar Samad)
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