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  • idea to avoid hole in glass wafer bonded with acoustic sensor (Aarti Ji)
  • Looking for an adhesive with fast cure @ room temperature (ssood)
  • T-gate process by electron beam lithography (yangx349)
  • idea to avoid hole in glass wafer bonded with acousticsensor (Bill Moffat)
  • idea to avoid hole in glass wafer bonded with acousticsensor (shay kaplan)
  • Post bake for AZ P4620 photoresist (Robert Black)
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Process Variations in Microsystems Manufacturing