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  • Porous silicon: thermal expansion coefficient, specific heat (Miyakawa, Natsuki)
  • Higher electrical resistivity of electroplated copper ? (Kagan Topalli)
  • Re: Trying to Study Diffusion profile (Mathieu Foquet)
  • Silicon nitride residual stress (Andrea Mazzolari)
  • Higher electrical resistivity of electroplated copper ? (David Nemeth)
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