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  • Re: Mask for ICP (dry etching) (Mihaela Carp)
  • adding contact to the electrostatic-structural problem (Mohammad Shavezipur)
  • adding contact to the electrostatic-structural problem ([email protected])
  • Adding contact to structural-electrostatic solver ESSOLV in ANSYS (Mohammad Shavezipur)
  • Isotropic silicon etch (Chilcott, Dan W)
  • Affordable Plasma Cleaner that is non- RF emissions compliant (Ron Martin)
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