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  • TiO2 thin film mechanical properties deposition dry etching (Jin Yu)
  • Pyrex isotropic etching (Edward Sebesta)
  • Silicon Carbide Bonding (Ben Pecholt)
  • Hf resistant Adhesion layer for Au on Si (Michael Larsson)
  • Low-temperature ALD for Al2O3 or HfO2 (Maggie Q. Lai)
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