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  • Nickel thickness (mohsen kazemy)
  • Photoresist and silane (Alexandre BOE)
  • Lithography on Cu foils (Michael D Martin)
  • Lithography on Cu foils (Joseph Grogan)
  • TurboCad vs AutoCad (Robert MacDonald)
  • small amount of negative e-beam resist (li shifeng)
  • gain size of Al thin film (li shifeng)
  • scratch and dig specs for anodic bonding (Robert MacDonald)
  • Seeking advise in MEMS studies (Pavan Samudrala)
  • Photoresist and silane (Warren Dustin)
  • scratch and dig specs for anodic bonding (Mehmet Aykol)
  • Ashing effects (Evelyn B)
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