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  • make the su-8 surface flat (Gareth Jenkins)
  • residual stress vs. thin film thickness (Andrea Mazzolari)
  • aluminum etchant vs. copper vs. aluminum (Ned Flanders)
  • aluminum etchant vs. copper vs. aluminum (Shay)
  • make the su-8 surface flat (Shane GUO)
  • aluminum etchant vs. copper vs. aluminum (Kirt Williams)
  • Etching 200 nm into a Saphirre Wafer (Gary Hillman)
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