MEMS technology

EV Group Rolls out Automated Metrology System For Advanced Packaging, MEMS And Photonics Manufacturing

EVG®50 performs high-throughput, high-resolution measurements of critical wafer bonding and lithography process parameters in a flexible, customizable standalone platform EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for ...

Azo Sensors: 2016-07-12 - MEMS technology

Solar-Tectic Unveils Details of Breakthrough Solar Cell Technology at Energy Conference in Scotland

Crystalline thin-film silicon promises to be less expensive than silicon wafer technology due to low temperature processing and less material use. Importantly, the entire process is non-toxic since tin (Sn) is used in the perovskite material, rather than ...

Clean Tech: 2016-07-12 - MEMS technology

Graphene Could Revolutionize the Internet of Things

In addition, it meets other needs that neither microelectromechanical systems nor metal–oxide semiconductor capacitors can, such as good performance at a high frequency, miniaturization, and the ability to be tuned using low energy. The sandwich-shaped ...

cacm.acm.org: 2016-07-14 - MEMS technology

Mitsubishi ABLASER Laser Micromachining System

microelectromechanical systems (MEMS), semiconductors and medical equipment. Going forward, Mitsubishi Heavy Industries Machine Tool will also propose a new semiconductor manufacturing process that combines the ABLASER with the company’s other ...

Engineering: 2016-07-14 - MEMS technology

MEMS business

Collaboration in MEMS, sensors and ICs

MEMS & Sensors Industry Group (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on ...

Solid State Technology: 2016-07-12 - MEMS business

Imec and Synopsys announce interconnect resistivity model

To use the new resistivity model, customers simulate the fabrication of the interconnect structure in 3D using the Synopsys process emulation tool Process Explorer, and then simulate the wire and via resistance in Raphael, the Synopsys interconnect field ...

Electronics Weekly: 2016-07-13 - MEMS business

Automotive MEMS Sensor Unit-Shipments Rose in 2015, Even as Revenue Stalled

"Just three types of MEMS devices used in the automotive industry account for more than 95 percent of market value: pressure sensors, accelerometers and gyroscopes" LONDON (July 14, 2016) – Although shipments of microelectromechanical systems (MEMS ...

press.ihs.com: 2016-07-14 - MEMS business

Invensas and Jabil collaborate on interconnect technology

Tessera Technologies' subsidiary Invensas Corporation and EMS provider Jabil, have completed the first phase of qualification of Invensas Bond-Via-Array (BVA) interconnect technology. “BVA is a proven high density, 3D interconnect technology for Package ...

Evertiq: 2016-07-12 - MEMS business

Unisem Continues to Invest in Fast Growing MEMS Market After Shipping 1 Billion Packaged MEMS Devices

Unisem recently shipped their one billionth packaged MEMS device and they continue to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market. With MEMS device revenues forecasted to grow ...

TMCnet.com: 2016-07-13 - MEMS business

Nanotechnology

Graphene sheets open like a flower’s petals when poked

Such devices could allow for nanoscale electronics and fast-processing computers. “It would take a bit of work to do that, but it might be able to,” he says. Engineers could also prepare the sheets to tear at specific temperatures, says Cross.

New Scientist: 2016-07-13 - Nanotechnology

Nanoscale Structure and Elasticity of Pillared DNA Nanotubes

We present atomistic model of pillared DNA nanotubes (DNTs) and their elastic properties which will facilitate further studies of these nanopores in several important nanotechnological and biological applications. In particular, we introduce a ...

ACS: 2016-07-12 - Nanotechnology

Scientists engineered 'sand' that can cool electronic devices

The unique surface properties of the coated nanoscale silicon dioxide conducts the heat at potentially higher efficiency than existing heat sink materials, researchers said. The theoretical physics behind the phenomenon is complicated, involving nanoscale ...

Daily News and Analysis: 2016-07-14 - Nanotechnology

Nanotech business

Nano Dimension Files Patent Application for New Nanometric Conductive Ink

The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks. In addition to the trading of the company's American Depositary ...

Yahoo Finance: 2016-07-14 - Nanotech business

Featured Event

Event Calendar

Sensors Midwest 2016-09-27 - 2016-09-28 Rosemont, IL
uTAS 2016 2016-10-09 - 2016-10-13 Dublin, Ireland The 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences
Micro Photonics International Congress Expo 2016-10-11 - 2016-10-13 Messe Berlin Germany Innovation and Miniaturization in Photonics
MEMS 2017 2017-01-22 - 2017-01-26 Las Vegas, Nevada The 30th Annual IEEE International Conference on Micro Electro Mechanical Systems