|
MEMS technology
- Water on the moon? NASA MEMS-based Phazir spectrometer chat with Steve Senturia
- (October 20, 2010) -- When NASA wanted to look for water on the moon, it used a MEMS-enabled near-IR portable spectrometer. At the MEMS Technology Summit, ...
today ElectroIQ - MEMS technology
- I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : Renesas to ...
- (2) high-speed chip-to-wafer bonding technology using chips with electroless plated pads, (3) high-productive wafer-level mold underfilling technology for approximately 10-micrometer (µm) gaps. Using FO-WLP, Renesas Electronics has ...
today - MEMS technology
MEMS business
- PositiveID receives initial order for 15000 RF iGlucose units
- ... a combination of the analyte binding surface chemistry with micro electro mechanical system technology and radio frequency inductive powered sensing. ...
today RFID News - MEMS business
 Xtrinsic sensors trigger satellite airbags
- Freescale's new Xtrinsic airbag sensors use the company's high aspect ratio micro-electromechanical system (HARMEMS) to provide a larger mass for the ...
yesterday EETimes.com - MEMS business
- 3-D chips and evolving test strategies take center stage at ITC
- A. They will learn about all major challenges, such as probing, signal integrity, DFT, and TSV characterization. Q. What other topics are hot this year? ...
today Test & Measurement World - MEMS business
- French Microelectronics Research Institute to Work with FRT's MFE
- For 3D IC / TSV (Through Silicon Via) measurements, the tool incorporates a new technology for measuring particularly small TSV's with a very high aspect ...
today TMCnet - MEMS business
Nanotechnology
- Nanoscale Analysis of Rechargeable Batteries Pinpoints Cause of their Demise
- It is my fervent belief that nanotechnology's ability to push the lowly battery to new heights will be one of the field's biggest achievements in the ...
today IEEE Spectrum - Nanotechnology
Featured Event
 This conference gives a broad, yet thorough perspective on the technomarket opportunity and challenge offered by building devices and systems in the vertical dimension. Industry leaders from around the world are invited to speak at this conference on a wide range of topics important to the emerging and on-going 3-D integration and packaging.
Visit here for details and register today!
Event Calendar
- IEEE Sensors 2010
- 2010-11-01 - 2010-11-04
Waikoloa Beach, Hawaii
The 9th Annual IEEE Conference on Sensors
Visit MNX at Booth 9 and at Special Session VIII
- MEMS Executive Congress 2010
- 2010-11-03 - 2010-11-05
InterContinental Montelucia, Scottsdale, AZ, USA
The 6th MEMS Industry Group (MIG) hosted event
- 3-D Architectures for Semiconductor Integration and Packaging
- 2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets
- IEEE MEMS 2011
- 2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems
- Transducers' 11
- 2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems
|
|
