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MEMS technology
- Xilinx releases stacked silicon interconnect
- It uses 3D packaging technologies and through-silicon vias (TSV) for its 28nm 7 series FPGAs. Xilinx's Targeted Design Platforms claims to be able to handle ...
yesterday Fudzilla - MEMS technology
- Vertical die stacking goes 3D without TSV
- 3D integration with through-silicon via (TSV) technology offers the highest level of integration, but TSV is several years away from full commercial ...
today ElectroIQ - MEMS technology
MEMS business
- DALSA Reports Record Third Quarter 2010 Revenue; Increases Dividend
- I am particularly encouraged by our progress in MEMS. In the third quarter, MEMS shipments increased significantly, quarter over quarter, ...
today MarketWatch (press release) - MEMS business
- I-Micronews - MEMS BUSINESS/MARKET: Digital MEMS microphones from ...
- L) launched its next-generation digital silicon micro-electro-mechanical-systems (MEMS) microphones, the WM7210 and the WM7220. The digital MEMS are manufactured with Wolfson's CMOS/MEMS membrane design, similar to the company's analog ...
today - MEMS business
- Mandates to boost auto MEMS sensor market in Korea and Japan, says iSuppli
- New mandates set to increase the safety of vehicles in South Korea and Japan will cause market revenue for MEMS automotive sensors in those countries to ...
today Digitimes - MEMS business
- STMicro Reports 3Q Earnings
- STMicro saw revenue growth across most of its product lines, but fared particularly well in microelectromechanical systems (MEMS) chips used to sense motion ...
yesterday Morningstar.com - MEMS business
- I-Micronews - MEMS BUSINESS/MARKET: Gaming market reveals changes ...
- The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. In a $418M consumer gyroscope market in 2010, gaming represents a market segment of $162M according ...
today - MEMS business
 Xilinx announces 28nm FPGA family, fabricated by TSMC
- Xilinx has announced its 28nm 7 series FPGAs, which embrace 3D packaging technologies and through-silicon vias (TSV) for applications requiring ...
yesterday Digitimes - MEMS business
- MEMS gyroscope market says gaming FTW, though smartphone apps growing
- This is most apparent with MEMS gyroscopes. The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS ...
today ElectroIQ - MEMS business
- Cascade Microtech to Discuss Latest Breakthroughs in 3D Device Test ...
- Mr. Smith will discuss how contacting at TSV pitches is practical with evolutions of existing probe technology, and how new probe technology enables test ...
today MarketWatch (press release) - MEMS business
- MEMSCAP: 8% Net Profit for the Third Quarter 2010
- MEMSCAP (Paris:MEMS)(NYSE Euronext: MEMS), the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, ...
today Business Wire (press release) - MEMS business
Featured Event
 In its sixth year, MEMS Executive Congress is the executive conference that connects the MEMS supply chain with MEMS end-users. Through keynotes, panel discussions, and numerous networking opportunities, MEMS Executive Congress creates an intimate forum for decision-makers to grow the global MEMS market. Register today! Event Calendar
- IEEE Sensors 2010
- 2010-11-01 - 2010-11-04
Waikoloa Beach, Hawaii
The 9th Annual IEEE Conference on Sensors
Visit MNX at Booth 9 and at Special Session VIII
- MEMS Executive Congress 2010
- 2010-11-03 - 2010-11-05
InterContinental Montelucia, Scottsdale, AZ, USA
The 6th MEMS Industry Group (MIG) hosted event
- 3-D Architectures for Semiconductor Integration and Packaging
- 2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets
- IEEE MEMS 2011
- 2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems
- Transducers' 11
- 2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems
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