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MEMS technology
- 3D IC, WLP & TSV : NEPES silicon interposer module contains IPD and TSV
- The 0.2 mm thick SI interposer has Cu TSV and a multiple redistribution layers on both sides. The package also contains a low bandpass filter composed of ...
yesterday R & D Magazine - MEMS technology
MEMS business
- RTI Scientists Approves Alchimer's Electrografting Film for 3D Applications
- The company's deposition technology reduces overall cost of ownership for high-aspect-ratio TSV metallization by up to two-thirds compared to conventional ...
today AZoNano.com - MEMS business
- SiTime Enters $2 Billion Resonator Market With World's First MEMS Resonator ...
- SiTime Corporation, the leader in MEMS-based silicon timing solutions, today introduced the SiT1052, the first MEMS resonator for real time clock and ...
today PR-USA.net (press release) - MEMS business
 Artificial kidney made by Indian American awaits human trials
- Roy, whose background is in the development of medical devices using micro-electromechanical systems (MEMS) technology, has also worked on the development ...
today Sify - MEMS business
 Microfluidics to fight cholera
- Giuseppe Maruccio and researchers at the University of Salento and the Institute of Nanoscience in Lecce have devised a new microfluidic chip that they say ...
today Chemistry World - MEMS business
- article-top.com » Highly Integrated accurate MEMS inertial sensor
- ADI Company MEMS / iSensor business development manager Bob Scannell of the sensor portion shows: “To a lot of apparatus designers, because integrated level and characteristic of the commercial grade of inertial sensors are relatively ...
admin today - MEMS business
Featured Process
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- Spot size below 2.5 nm
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