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MEMS technology
- Package-on-package: thinner, faster, denser
- The first-generation of PoP can be characterized as: wirebond interconnects for the mobile processor fabricated on 130 to 90nm CMOS running both the base band modem and multimedia application processing functions. A 0.65mm pitch memory interface ...
yesterday ElectroIQ - MEMS technology
MEMS business
- Historic semiconductor industry, SEMI moments from Stanley Myers
- 3D IC and through silicon vias (TSV) are fascinating technologies that will propel the continuation of Moore's Law, Myers adds, looking to the semiconductor manufacturing industry's future. At SEMI, he considers most important the organization's ...
today ElectroIQ - MEMS business
 CEA-Leti Announces Major Improvement in 200mm RF MEMS Switch Manufacturing Process
- CEA-Leti announced today that its RF MEMS switch technology has reached a new level of maturity, allowing it to provide customers with a significantly improved manufacturing process. A major advance has been achieved in the reliability of the devices' ...
today Nanotechnology News (press release) - MEMS business
 Advanced Micro-Fabrication Equipment Introduces Primo AD-RIE Etch Tool
- By Cameron Chai Advanced Micro-Fabrication Equipment will unveil a sophisticated etch tool to tackle the production challenges of leading-edge film stacks at SEMICON West. The Primo AD-RIE tool is the second-generation 300 mm ultra-high frequency ...
today Azom.com - MEMS business
 Olympus-ITA Offers 3DIR Metrology & Defect Review System
- Automated measurement of a sampling of bonded wafer overlay alignment points will quickly characterize the wafer bonding alignment accuracy as well as provide indications of bond quality problems. Olympus' 3DIR metrology system measures alignment ...
yesterday PCB007 (press release) - MEMS business
- SEMICON West 2011: Rasco Introduces Its New ATU and PTU MEMS Test ...
- Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary and a leader in test handling equipment and MEMS testing, announced today the introduction of two new advanced.
Reah yesterday - MEMS business
- Development of Industry's First TSV Stacking Technology based DDR3 ...
- Elpida Memory has announced the industry's first DDR3 SDRAM which was developed based on TSV (Trough Silicon Via) stacking technology.
sia today - MEMS business
- EV Group highlights technology firsts, key advancements at SEMICON WEST 2011
- ... was developed to facilitate the industry shift to 450-mm wafers from the current 300-mm standard, and is optimized for SOI because it delivers better power/performance for sub-22 nm CMOS and 3D technologies compared to similar-geometry bulk CMOS. ...
yesterday Global SMT & Packaging Magazine - MEMS business
- Olympus-ITA Introduces 3DIR Metrology and Defect Review System at SEMICON West ...
- Automated measurement of a sampling of bonded wafer overlay alignment points will quickly characterize the wafer bonding alignment accuracy as well as provide indications of bond quality problems. Olympus' 3DIR metrology system measures alignment ...
yesterday EON: Enhanced Online News (press release) - MEMS business
- Imec – 3D integrated DRAM-on-logic for low-power mobile applications demonstrated
- The 3D stack resembles as close as possible to future commercial chips. It consists of Imec's proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps. Heaters were integrated to test the ...
today Electropages (press release) - MEMS business
- Leti and Replisaurus Reach Milestone in Project to Commercialize ...
- (Nanowerk News) CEA-Leti and Replisaurus Technologies, Inc., a developer of a metallization technology for integrated passives, copper pillars and 3D integration (TSV), today announced that they have completed a crucial step toward commercialization of ...
today Nanowerk LLC - MEMS business
- ESI Revolutionizes Via Drilling for Advanced LED Packaging
- The Model 5390 laser-based micromachining system is uniquely designed for creation of electrical interconnections on LED packages and is optimized for industry-leading via placement accuracy and high yields. "Our customers are demanding new, ...
today MarketWatch (press release) - MEMS business
- Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold ...
- Meanwhile, SUSS MicroTec, which sells wafer bonding devices globally, will develop a wafer-level transfer and bonding equipment using such transfer substrates. This technology development is being carried out with the cooperation of Professor Shuichi ...
yesterday Your Industry News (press release) - MEMS business
 Tanaka Kikinzoku Kogyo and SUSS MicroTec to Develop Wafer Bonding Technology
- By Cameron Chai SUSS MicroTec will collaborate with Tanaka Kikinzoku Kogyo to develop bonding technology and pattern transfer with the help of gold particles of sub-micron dimensions. This joint venture will result in the technological development to ...
today AZoNano.com - MEMS business
- SiTime Launches MEMS VCTCXO Products to Support High Frequencies
- By Cameron Chai SiTime, a company that manufactures analog semiconductors, has launched high-stable, MEMS voltage controlled, temperature compensated oscillator (VCTCXO) devices. These devices are utilized in networking, wireless, ...
today AZoNano.com - MEMS business
 Oxide, doped oxide and nitride CFD films for advanced semiconductor manufacturing
- Figure 2 shows a conformal oxide film being used as a TSV liner where 100 percent step coverage can be maintained on vias with aspect ratios in excess of 20:1. This exceptional step coverage allows customers to reduce the overall field thickness of the ...
today EE Herald - MEMS business
Nanotechnology
- Beijing start-up makes nanostructures that could result In cheaper ...
- Further research needs to be done to bring nanotechnology-tuned solar cells to the market. Posted: Jul 12th, 2011. Beijing start-up makes nanostructures that could result In cheaper electric car batteries ...
yesterday - Nanotechnology
 Research update: New way to store sun's heat
- The resulting molecules, produced using nanoscale templates to shape and constrain their physical structure, gain “new properties that aren't available” in the separate materials, says Grossman, the Carl Richard Soderberg Associate Professor of Power ...
yesterday MIT News - Nanotechnology
 Magic of "Invisibility" Close At Hand: Space, Time and Sound to Disappear
- A new material created by the researchers is a nanoscale structure that allows light to pass through as if it was traversing empty space, says Reuters. The Columbia scientists "sculpted" a cascading series of nanostructures smaller than light waves, ...
today International Business Times - Nanotechnology
Featured Event
µ5TAS 2011 continues a series of Conferences that are the premier forum
for reporting research results in microfluidics, microfabrication,
nanotechnology, integration, materials and surfaces, analysis and
synthesis, and detection technologies for life science and chemistry.
Registration opens June 1 at www.microtas2011.org.
Event Calendar
- MIG Webinar: Global Analysis of the Current MEMS Market
- 2011-07-27
Online - July 27, 2011 at 11:30 AM ET
A global analysis of MEMS markets with a focus on the supplier landscape
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- Technologies for Future Micro and Nano Manufacturing
- 2011-08-08 - 2011-08-10
Napa, California
Stimulating domestic micro and nano manufacturing
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- COMS 2011
- 2011-08-28 - 2011-08-31
Greensboro NC
Commercialization of Micro - Nano Systems
Visit MNX at this event.
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- MicroTAS 2011
- 2011-10-02 - 2011-10-06
Seattle, Washington
The 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences
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- SENSORS Tech Forum '11 Boston
- 2011-10-10 - 2011-10-12
Boston, MA
NASA Tech Briefs Presents SENSORS Tech Forum
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- MEMS in Motion Collaboration Summit
- 2011-10-12 - 2011-10-13
Palm Springs, CA
It's not who you know today. It's who you're going to need to know tomorrow.
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- MEMS Executive Congress 2011
- 2011-11-02 - 2011-11-03
Monterey, CA
Connecting the MEMS supply chain with MEMS end-users
Visit MNX at this event.
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- IEEE MEMS 2012
- 2012-01-29 - 2012-02-02
Paris, France
Focus on Strategies for Reducing Time and Cost of MEMS Testing
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- MEMS Executive Congress 2012
- 2012-03-20
Zurich, Switzerland
MEMS Industry Group event co-located with Smart Systems Integration
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- Hilton Head Workshop 2012
- 2012-06-03 - 2012-06-07
Hilton Head Island, SC
A Solid-State Sensors, Actuators and Microsystems Workshop
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