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ProtoSi -- Reliable MEMS Processing
ProtoSi -- Reliable MEMS ProcessingMEMS Process Specialists: DRIE, Spray Resist (thick and conformal), Sputter, Wafer bonding, Sealing, Flip-Chip bonding and direct-write conductive ink.

  • Silicon DRIE: SOI, thru-wafer, TSV, metals OK.
  • Spray Resist: conformal, post-DRIE.
  • Sputter: Au, Cu, TiW...
  • Wafer Bonding: hermetic seal & packaging.
  • Flip-chip bonding.
  • Direct-write conductive ink.
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