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  • SU-8 undercut issue. (Leidong Mao)
  • Does Cl-containing plasma attack Mo? (Isaac Wing Tak Chan)
  • microautomation dicing saw (Lee, Duhyun)
  • HF etching of sandwiched layer? (Patrick Lu)
  • help on liftoff fixture for metal liftoff ([email protected])
  • MEMS Strain guage (El Camino Tech)
  • Aluminum evaporation or Aluminum sparker (hengcw)
  • APC angle in ICP process (Blunier, Stefan)
  • APC angle in ICP process ([email protected])
  • Copper oxide stripping (Mark Schvartzman)
  • wet etch of SiO2 or SiC selective to NiSi/CoSi2 (de Marneffe Jean-Francois)
  • High volume thin film deposition systems ([email protected])
  • Aluminum evaporation or Aluminum sparker (R. Brent Garber) (2 parts)
  • SU-8 undercut issue. (Tony Li)
  • HF etching of sandwiched layer? ([email protected])
  • Copper oxide stripping (Sunil Kumar)
  • Copper oxide stripping (Park, Daniel Sang-Won)
  • Copper oxide stripping (Bill Moffat)
  • microautomation dicing saw (Bill Flounders)
  • microautomation dicing saw (email)
  • Aging of sputtered chrome (Mister Einstein)
  • SU-8 undercut issue. (Jacques Jonsmann)
  • Nitride recipe at low temp (Isa Kiyat)
  • microautomation dicing saw (Shile)
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Harrick Plasma
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Harrick Plasma, Inc.
Process Variations in Microsystems Manufacturing