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  • Polyimide vs HF (C.Y. Hsieh)
  • Image of MEMS device and the product in which it is used (Steven F. Nagle)
  • High frequency capacitance readout ([email protected])
  • Rayleigh damping - Si (Aksel Andreas)
  • Coupling Simulation in ANSYS (Hervé LEBLOND)
  • Si02 etching recipe ([email protected])
  • Other rubber material instead of PDMS inMicrofabrication (Michael D Martin)
  • Thermal coefficient of expansion on SI vs orientation (Dr. Vincent Choo)
  • Problems with RF Sputtering of PZT (S. S. Abhishek)
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