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  • 50 +/- 5 micron through hole in Pyrex wafer (Zheng Xia)
  • TiO2 refraction index (WALTER Harald)
  • Au film (WALTER Harald)
  • 50 +/- 5 micron through hole in Pyrex wafer (David Nemeth)
  • 50 +/- 5 micron through hole in Pyrex wafer (Andy Scholes)
  • BCB like resist with low curing temperature (Olivier Boulle)
  • PDMS glass bonding with allignment (Thomas Fruehwirth)
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