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  • Etchant for both photoresist germanium ([email protected])
  • Rep:Re: [mems-talk] AlN dry etching (Amandine KUBIE)
  • query regarding bonding. (vishal shenoy)
  • Shipley 1818 photoresist information (Yeswanth Rao)
  • Backside Oxidation remove for DRIE (Z.,W.Y.(Lydia))
  • Measurement of End contact resistance for CTLM model. (hare krishna)
  • Coventor-Damping (Ale)
  • 3D vs 2D MEMS (Jauniskis, Linas)
  • Z-ratio and density of ITO (Jeff)
  • Backside Oxidation remove for DRIE ([email protected])
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