UCLA materials scientists and colleagues at the nonprofit scientific research institute SRI International have developed a new material and manufacturing process for creating artificial muscles that are stronger and more flexible than their biological counterparts.
For this research, Intel used advanced lithography to define the waveguide gratings in silicon prior to the III-V wafer bonding process. This technique resulted in better wavelength uniformity compared to conventional semiconductor lasers manufactured in 3 ...
First, the bottom tier device is processed up to the contacts. Next, a blanket semiconductor layer is created on top of this tier by wafer transfer, using a wafer-to-wafer bonding technique. Then, the top-tier device is integrated, and the top and bottom ...
Wafer bonding and lithography specialist EVG has achieved a breakthrough in die-to-wafer (D2W) fusion and hybrid bonding. It has successfully demonstrated 100-percent void-free bonding yield of multiple die of different sizes use from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG's GEMINI FB automated hybrid bonding system.
YITOA Micro Technology Corporation has developed the MEMS Mirror IC for use in Automotive LiDAR. The company will begin shipping samples in July 2022. The Solid-State LiDAR using MEMS Mirror is expected to be one of the best ways to realize the LiDAR function.
