Integrating photonics into semiconductors is gaining traction, particularly in heterogeneous multi-die packages, as chipmakers search for new ways to overcome power limitations and deal with increasing volumes of data.
To implement these packaging techniques, Mounier says enabling technologies include: - Wafer-to-wafer bonding by a variety of techniques. While all of these topics were discussed, examples of wafer bonding and inspection equipment were available to ensure ...
Researchers at Queen's University Belfast are using microfluidics to fabricate particles for the encapsulation of drugs and biologics for imaging, treatment and cell targeting. Dr Dimitrios Lamprou, a Reader in Pharmaceutical Engineering at the School of Pharmacy,
The proposed device maintained a metal-insulator-metal structure composed of a thick gold layer placed on top of a silicon substrate to form the microelectromechanical systems mirror, while 2D ...
A collaboration between EPFL and UCSB has developed a long-anticipated breakthrough, and demonstrated CMOS technology—used for building microprocessors and memory chips—that allows wafer-scale manufacturing of chip-scale optical frequency combs.
