Part of the collaboration includes the construction of a state-of-the-art 200 mm pilot line in addition to the current 150 mm line of the PoliFab clean room. The new pilot line will be dedicated to the development of new MEMS technologies and the support of research projects,
In an effort for improved quality and lower power, TDK has released three new MEMS microphone solutions. How are these microphones pushing the limits of MEMS technology?
The company's extensive experience in AP includes die bonding, wafer bonding, extreme wafer thinning, copper and nickel damascene RDL, silicon interposers, chiplets, and micro transfer printing.
