However, the direct patterning of microelectronics onto small, curved objects used for clinical applications is challenging, since existing microfabrication processes are primarily tailored to flat substrates. Researchers have hitherto used two main transfer methods; including dry transfer and the wet transfer technique. Dry transfer typically ...
In this interview, AZoSensors talks to Shiva Pallinti, director of engineering at Merit Sensor, about Merit Sensor's capabilities in the MEMS market, and why an on-site wafer fab is a great benefit to the company and its customers. Why does Merit Sensor continue to own and operate a wafer fab on site, especially when many others have gone away ...
By applying their expertise to the field of Quantum Information Science (QIS), they discovered how to move quantum information on the nanoscale through quantum teleportation—an emerging topic within the field of QIS. Their findings were published in the journal, Nature Chemistry, on September 23, 2019 and have untold potential to influence ...
Samsung has improved on the current 8-layer High Bandwidth Memory-2 (HBM2) products by squeezing an extra four layers into the same thickness sandwich. Called 12-layer 3D-TSV (Through Silicon Via) technology, this relies on the pinpoint alignment of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of ...
Common issues of the present gravimetry technologies include their high cost, high mass, and large volume, which can potentially be solved by micro-electromechanical-system (MEMS) technology. However, the reported MEMS gravimeter does not have a high sensitivity and a large dynamic range comparable with those of the present commercial ...
