Process platform for wafer-level integration targets RF front-end module (FEM) manufacturing EV Group, a supplier of wafer bonding and lithography equipment, has announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a ...
Compoundsemiconductor.net: 2019-03-20 - MEMS business
Germanium (Ge) is a promising material for the development of a light source compatible with the silicon microfabrication technology, even though it is an indirect-bandgap material in its bulk form. Among various techniques suggested to boost the light ...
imec, a world-leading research and innovation hub in nanoelectronics, energy, and digital technologies and KU Leuven, both partners in EnergyVille, present a novel nanomesh material that could mean a breakthrough in a variety of sustainable-application ...
(Nanowerk News) Electrospinning uses electric fields to manipulate nanoscale and microscale fibers. The technique is well-developed but time-intensive and costly. A team from Michigan Technological University came up with a new way to create customizable ...
Electron microscopy shows gold atoms being gradually stretched from a rod in panels a-d into a chain in panels e-k. The black dots in panels e-k are single atoms. Credit: Hideki Masuda/Wikimedia ...
