or using wafer-bonding of epi layers on the backplane) New manufacturing technology adoption, new supply chains and cost of change Each of the above would seem to add cost and make LCDs and OLEDs more economical. However, KLA’s metrology, inspection ...
In this work, Sartipzadeh et al investigated the microfluidics droplet generation rates, including flow velocity via COMSOL Multiphysics simulator software to develop practical microfluidic chips ...
Eight new resins widen scope for mechanical meta-materials and life sciences researchers to 3D print, at micro scale, complex objects with novel properties Grenoble, France, June 14, 2022 – Microlight3D,
Intel and CEA-Leti have optimised a hybrid direct-bonding, self-assembly process for D2W (Die-to-Wafer) bonding that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach ...
Shares of Sai Microelectronics surged after the Chinese semiconductor manufacturer said the production of its new type of micro-electromechanical systems that its affiliate made for a client had been verified and began trial production.
